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Blasting Equipment - 企業ランキング(全45社)

更新日: 集計期間:May 06, 2026〜Jun 02, 2026
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会社名 代表製品
製品画像・製品名・価格帯 概要 用途/実績例
Dimensions: 1050(W)×1329(D)×1935(H)mm Processing Size: φ750×600(H)mm Load Capacity: 50kg Gun: 3/8 inch compact gun x 1 Power Consump... ・Mold cleaning ・Bolt cleaning ・Parts cleaning ・Rust removal
Dimensions: 1700(W)×1650(D)×1650(H)mm Blast Gun: Wide gun 220mm, one on each side Target Work: Width: 20–200mm, Length: 100–250mm (proce... - Deflashing of IC/LED lead frames - Resin burr removal
Dimensions: 1700(W)×1650(D)×1650(H)mm Blast Gun: Wide gun 220mm, 1 piece each up and down Target Work: Width: 20–200mm, Length: 100–250m... - Deflashing of IC/LED lead frames - Resin burr removal - Removal of powder from ceramic substrates - Removal of non-conductive layers
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  1. 代表製品
    Heavy-duty manual wet blast device "Grandet"Heavy-duty manual wet blast device "Grandet"
    概要
    Dimensions: 1050(W)×1329(D)×1935(H)mm Processing Size: φ750×600(H)mm Load Capacity: 50kg Gun: 3/8 inch compact gun x 1 Power Consump...
    用途/実績例
    ・Mold cleaning ・Bolt cleaning ・Parts cleaning ・Rust removal
    Dedicated wet blast equipment for semiconductor package burr removal (SLX)Dedicated wet blast equipment for semiconductor package burr removal (SLX)
    概要
    Dimensions: 1700(W)×1650(D)×1650(H)mm Blast Gun: Wide gun 220mm, one on each side Target Work: Width: 20–200mm, Length: 100–250mm (proce...
    用途/実績例
    - Deflashing of IC/LED lead frames - Resin burr removal
    Wet blast device for thin plate work "mini PFE 200"Wet blast device for thin plate work "mini PFE 200"
    概要
    Dimensions: 1700(W)×1650(D)×1650(H)mm Blast Gun: Wide gun 220mm, 1 piece each up and down Target Work: Width: 20–200mm, Length: 100–250m...
    用途/実績例
    - Deflashing of IC/LED lead frames - Resin burr removal - Removal of powder from ceramic substrates - Removal of non-conductive layers