Blasting Equipment - 企業ランキング(全45社)
更新日: 集計期間:May 06, 2026〜Jun 02, 2026
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企業情報を表示
| 会社名 | 代表製品 | ||
|---|---|---|---|
| 製品画像・製品名・価格帯 | 概要 | 用途/実績例 | |
Heavy-duty manual wet blast device "Grandet"
1 million yen-5 million yen |
Dimensions: 1050(W)×1329(D)×1935(H)mm Processing Size: φ750×600(H)mm Load Capacity: 50kg Gun: 3/8 inch compact gun x 1 Power Consump... | ・Mold cleaning ・Bolt cleaning ・Parts cleaning ・Rust removal | |
Dedicated wet blast equipment for semiconductor package burr removal (SLX)
1 million yen-5 million yen |
Dimensions: 1700(W)×1650(D)×1650(H)mm Blast Gun: Wide gun 220mm, one on each side Target Work: Width: 20–200mm, Length: 100–250mm (proce... | - Deflashing of IC/LED lead frames - Resin burr removal | |
Wet blast device for thin plate work "mini PFE 200"
1 million yen-5 million yen |
Dimensions: 1700(W)×1650(D)×1650(H)mm Blast Gun: Wide gun 220mm, 1 piece each up and down Target Work: Width: 20–200mm, Length: 100–250m... | - Deflashing of IC/LED lead frames - Resin burr removal - Removal of powder from ceramic substrates - Removal of non-conductive layers | |
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- 代表製品
-
Heavy-duty manual wet blast device "Grandet"
- 概要
- Dimensions: 1050(W)×1329(D)×1935(H)mm Processing Size: φ750×600(H)mm Load Capacity: 50kg Gun: 3/8 inch compact gun x 1 Power Consump...
- 用途/実績例
- ・Mold cleaning ・Bolt cleaning ・Parts cleaning ・Rust removal
Dedicated wet blast equipment for semiconductor package burr removal (SLX)
- 概要
- Dimensions: 1700(W)×1650(D)×1650(H)mm Blast Gun: Wide gun 220mm, one on each side Target Work: Width: 20–200mm, Length: 100–250mm (proce...
- 用途/実績例
- - Deflashing of IC/LED lead frames - Resin burr removal
Wet blast device for thin plate work "mini PFE 200"
- 概要
- Dimensions: 1700(W)×1650(D)×1650(H)mm Blast Gun: Wide gun 220mm, 1 piece each up and down Target Work: Width: 20–200mm, Length: 100–250m...
- 用途/実績例
- - Deflashing of IC/LED lead frames - Resin burr removal - Removal of powder from ceramic substrates - Removal of non-conductive layers
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